Postforming laminates have the characteristic of being formable under heating. This property allows the achievement of elements which do not show joints or sharp edges. The lack of joints avoid the accumulation of dirt or the infiltration of water, giving a higher aesthetic result. A good postforming result depends upon a correct equilibrium between speed, temperature, curving radius and laminate thickness.

LPR high pressure laminate should be heated quickly to reach a minimum temperature of 150°C. However, the maximum temperature the laminates should be heated is 165°C. At temperatures exceeding 180°C LPR high pressure laminate begins to show blisters.

The best method to measure the temperature on the laminate surface is to apply heat sensitive waxes on the area to be formed. These waxes melt at a set temperature and will give a very accurate sign that the laminate has reached the temperature required.

The most common substrate utilized in the postforming process is chipboard due to its smooth surface.

Plywood used as a substrate for postforming can cause more problems than chipboard because of the layers of glue which very often make the surface of the edge not homogeneous enough. Instead, MDF may be a perfect substrate because of the complete lack of chips, and the perfect homogeneity throughout the thickness.

For Metals, it will be necessary to use lower temperatures than normal, usually around 120°C. Their blistering appears at lower temperatures than regular decorative laminates, which are around 140°C.